-. Á¦Ç° ƯÀåÁ¡,
* ELS 3.3 ³³¶« ½Ã½ºÅÛÀº Áß¼Ò·®ÀÇ »ý»ê º¼·ýÀ» À§ÇØ ¼³°è.
* ½ÀÀ±¼º ¹× ¿ª·ù ³ëÁñÀÌ ÀÖ´Â ÇÁ·Î±×·¥Çϱ⠽¬¿î ¸¶ÀÌÅ©·ÎÆÄ´Â ÃÖÀûÈ µÈ ÆÄ¶ó¹ÌÅ͸¦ »ç¿ëÇÏ¿© ¸ðµç ÇÏÀ§ ¾î¼Àºí¸®¸¦ ó¸®.
* ³³¶« ¸ðµâ¿¡´Â Ãà Á¦¾î Ç÷°½º ½Ã½ºÅÛ°ú ÇÏÀ§ ¾î¼Àºí¸® »ý»êÀ» À§ÇØ Æ¯º°È÷ °³¹ß.
* ´Ù´Ü À¯¸®º¸È£ â°ú ¼¼¶ó¹Í ¿¹¿ ½Ã½ºÅÛÀÌ ÀåÂø.
-. Á¦Ç° »ç¾ç.
Dimensions L x W x H: 3150 x 1100 x 1800 mm
Weight: approx. 1000 kg without solder
Principle of function: Miniwave (max. 4)
Processible formats: max. LP 460 x 460 mm or WT
Fluxer: X/Y Microdrop, spray fluxer
Pre-heating: IR, top heating optional
Soldering wave: 3 - 40 mm as standard
Solder bath: 40 50 kg, max. 350¡ÆC, coated in high-grade steel
Nitrogen consumption: 0.2 6 m3/h
Nitrogen pre-heating: Up to 250¡ÆC
Options:
2 solder crucibles
Quick-change crucible
Full wave module
N2 pre-heating up to 250¡ÆC
Several miniwave modules (parallel operation or additional tools)
N2 monitoring as process control
High-performance IR bottom heating
High-performance IR top heating
Process monitoring camera in realtime
Position correction (Fiducial module)
Warpage correction to prevent deflections
Barcode reader for selecting programs with process parameters
Integration of a workplace as a loading shuttle
Traceability concept available